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Synopsys, Inc. 2026 Q3: EDA acceleration tied to advanced packaging, AI complexity, and hardware-assisted verification
EDA acceleration tied to advanced packaging, AI complexity, and hardware-assisted verification
- Management linked Q3 EDA performance to broader strength in the portfolio and emphasized Design Automation momentum.
- They cited advanced package 3DIC and multi-die architectures as key contributors to EDA demand and to the move toward more specialized chips.
- AI was described as a tailwind as customers rethink how to reengineer engineering workflows for complex AI compute designs.
- Hardware-assisted verification was highlighted with a record quarter for hardware revenue as part of the EDA growth underpinnings.
- In Q&A, they attributed confidence in double-digit organic EDA growth to multiple factors including AMD’s use of 3DIC Compiler for new GPU product series.